Contact grid array formed on a printed circuit board
作者： John D. Williams , Dirk D. Brown
DOI:
关键词: Land grid array 、 Electrical engineering 、 Grid 、 Printed circuit board 、 Integrated circuit packaging 、 Base (geometry) 、 Integrally closed 、 Electrical connection 、 Optoelectronics 、 Engineering 、 Electrical conductor
摘要: A printed circuit board includes a dielectric layer and an area array of contact elements extending above first surface the layer. Each element conductive portion disposed to engage respective pad land grid module for providing electrical connection module. The can include package or second board. In one embodiment, are selected from group types including metal springs, bundled wires, in polymer, solid tabs. another base material elastic formed integrally with whereby extends protrudes
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