Adhesive and encapsulating material with fluxing properties
作者： Hugh Patrick Craig , David John James Lowrie
DOI:
关键词: Catalysis 、 Reactivity (chemistry) 、 Polymer 、 Substrate (printing) 、 Adhesive 、 Materials science 、 Thermosetting polymer 、 Oxide 、 Soldering 、 Composite material
摘要: The attachment of an electrical component to termination on a component-carrying substrate by solder bump technique thermally curable adhesive composition for encapsulating purposes is described which comprises thermosetting polymer and chemical cross-linking agent has fluxing properties but unreactive or severely restricted reactivity with the without action heat and/or catalyst. be when heated soldering temperatures in reaction catalyzable merely metal oxide fluxed from surfaces then dissolved polymer.
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