Die attach adhesive compositions
作者： Pui Kwan Wong , Shridhar Ratnaswamy Iyer
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摘要: A novel thermally reworkable die attach adhesive composition for attaching a semiconductor device to substrate is provided. The comprises (a) cross-linked resin produced by reacting at least one dienophile having functionality greater than and 2,5-dialkyl substituted furan-containing polymer, (b) and/or electrically conductive material present in an effective amount up 90 % weight of the provide conducting medium.
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