Method for aligning carbon nanotubes containing magnetic nanoparticles in a thermosetting polymer using a magnetic field

作者: Dylan J. Boday , Joseph Kuczynski , Robert E. Meyer

DOI:

关键词:

摘要: The chip stack of semiconductor chips with enhanced cooling apparatus includes a first circuitry on side and second electrically mechanically coupled to the by grid connectors. further thermal interface material pad between chip. comprises plurality nanotubes containing magnetic material, aligned parallel mating surfaces chip, wherein hydrophobic tail oleic acid is wrapped around each one hydrophilic head attached material.

参考文章(76)
Jianwen Bao, Qunfeng Cheng, Ben Wang, Zhiyong Liang, Chun Zhang, Nanoscale Fiber Films, Composites, and Methods for Alignment of Nanoscale Fibers by Mechanical Stretching ,(2010)
Bing Zhou, William S. Milner, Brett M. Silverman, Metal colloids and methods for making the same ,(2008)
Joseph Kuczynski, Kevin A. Splittstoesser, Timothy J. Tofil, Arvind K. Sinha, System and method to process horizontally aligned graphite nanofibers in a thermal interface material used in 3d chip stacks ,(2011)
Arun Majumdar, Lance Delzeit, Yang Zhao, Ali Kashani, Tao Tong, Meyya Meyyappan, Carbon nanotube arrays as thermal interface materials ,(2007)
Pui Kwan Wong, Shridhar Ratnaswamy Iyer, Die attach adhesive compositions ,(1997)
Shou-Shan Fan, Chang-Hong Liu, Hua Huang, Yang Wu, Method for manufacturing a thermal interface material ,(2005)
Robert Edward Aldaz, Anastasios Golnas, David Yu, Larry Stuckey, Thermal controller for electronic devices ,(2007)
Robert J. Fite, David S. De Lorenzo, Stephen W. Montgomery, Increasing thermal conductivity of thermal interface using carbon nanotubes and CVD ,(2002)
Shinya Kita-ku Tateda, Naoyuki Kita-ku Shimoyama, Masayuki Kita-ku Tobita, Natsuko Kita-ku Ishihara, Thermally conductive polymer composition and thermally conductive molded article ,(2001)