作者: Dylan J. Boday , Joseph Kuczynski , Robert E. Meyer
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摘要: The chip stack of semiconductor chips with enhanced cooling apparatus includes a first circuitry on side and second electrically mechanically coupled to the by grid connectors. further thermal interface material pad between chip. comprises plurality nanotubes containing magnetic material, aligned parallel mating surfaces chip, wherein hydrophobic tail oleic acid is wrapped around each one hydrophilic head attached material.