Composites comprised of aligned carbon fibers in chain-aligned polymer binder
作者： Joseph Kuczynski , Arden L. Moore , Amanda E. Mikhail
DOI:
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摘要: A method for enhancing internal layer-layer thermal interface performance and a chip stack of semiconductor chips using the method. The includes adding thermosetting polymer to material, dispersing plurality nanofibers into un-crosslinking in material. further extruding material through die orient conductive axis chains desired direction, re-crosslinking first with circuitry on side, second coupled by grid connectors, pad between chips. that allows optimal alignment chains.
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