Die attach material for TBGA or flexible circuitry
作者： Tongbi Jiang
DOI:
关键词:
摘要: An attachment material is provided between the die and solder balls of a TBGA or other flexible circuitry package that sufficiently compliant to absorb pressure two, so as not apply stress balls. The also rigid, with low coefficient thermal expansion (CTE), does excessively expand contract during cycling relative die. More preferably, has CTE close prevent breakage tape at junction
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