Semiconductor apparatus and electronic system
作者： Hideyuki Takahashi , Haruhiko Makino
DOI:
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摘要: A semiconductor apparatus includes a device and wiring member having an insulating resin base, layers connected to the individual electrodes of device, external terminals. The or reinforcing plate placed around are bonded each other with elastic material therebetween. retains rubber elasticity under environmental conditions fabrication process use. An electronic system as described above.
lens.org 参考文章(8)
Robert C. Dobkin, Chong K. Lai, High thermal resistance bonding material and semiconductor structures using same ,(1989)
Konstantine Karavakis, John W. Smith, Craig Mitchell, Thomas H. DiStefano, Method of encapsulating die and chip carrier ,(1994)
Thomas H. Distefano, Joseph Fjelstad, Konstantine Karavakis, John W. Smith, Craig S. Mitchell, Method of encapsulating a semiconductor package ,(1997)
Joseph Fjelstad, John W. Smith, Thomas H. DiStefano, Laterally situated stress/strain relieving lead for a semiconductor chip package ,(1996)
Norbert Guntherberg, Gerhard Lindenschmidt, Martin Weber, Konrad Knoll, Thermoplastic moulding compounds ,(1997)
Shuichi Matsuda, Eiji Hagimoto, Keiichiro Kata, Method for manufacturing bump leaded film carrier type semiconductor device ,(1995)
Shinichi Ishiwata, Kazushige Iwamoto, Koji Nakayama, Eiji Shiramatsu, Kenji Mougi, Morikuni Hasebe, Semiconductor wafer-securing adhesive tape ,(1992)
William F. Primeaux, Molded plastic package with wire protection ,(1992)