Method of encapsulating die and chip carrier
作者： Konstantine Karavakis , John W. Smith , Craig Mitchell , Thomas H. DiStefano
DOI:
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摘要: A method of packaging a semiconductor chip assembly includes the encapsulation same after establishing an area and providing physical barrier for protecting terminals carrier. An alternative or supplement to is provide preform material which predetermined volume such so that only filled. For does not yet have elastomeric layer, simultaneously forming layer encapsulating also provided.
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