作者: Richard C. Condra , Paul C. Healey , Michael R. Cochren , Eddie L. Wright
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摘要: A method to remove permanent photoimagable solder mask simultaneously from the insulating laminate and conductive metal traces of a printed circuit board comprising steps heating removing solution comprised an aqueous alkaline solution, organic penetrating softening agent tarnish corrosion inhibitor, contacting with on board, allowing soften, softened by rinsing water.