Low cost substrate for an integrated circuit device with bondpads free of plated gold

摘要: Disclosed herein is a process for assembling an integrated circuit, as well the assembly resulting from process, employing surface treatment of bondpad surfaces. In one aspect, method circuit includes providing substrate having electrical terminals on first side and second opposing side. this embodiment, electrically coupled to at least addition, mounting chip substrate, where component has lead adapted be wire-bonded terminal. The further removing oxidation bondpad, metallurgically bonded trace printed board. Moreover, embodiment bonding trace.