Ball grid array (BGA) encapsulation mold
作者： Leonard E. Mess
DOI:
关键词:
摘要: A molding machine for encapsulating electronic devices mounted on one side of a substrate, and having ball-grid array, pin-grid or land-grid array the opposite side, has two member biased floating plate apparatus to compensate variations in substrate thickness, gas collection/venting relieving gases emitted from non-encapsulated underside substrate.
lens.org 参考文章(34)
Masaaki Ishii, Transfer molding machine for encapsulation of semiconductor devices ,(1995)
Brian Drummond, Method for molding using venting pin ,(1993)
Hiroshi Saito, Ball grid array type semiconductor device ,(1995)
Patrick Variot, Method for encapsulating an integrated circuit package ,(1996)
Konstantine Karavakis, John W. Smith, Craig Mitchell, Thomas H. DiStefano, Method of encapsulating die and chip carrier ,(1994)
Gerhard Hinterlechner, Injection molding equipment for encapsulating semiconductor die and the like ,(1995)
Kuo K. Wang, Sejin Han, Pressurized underfill encapsulation of integrated circuits ,(1996)
Francis J. Carney, James K. Heckman, Harry J. Geyer, Semiconductor chip package and method of forming ,(1994)
James J. Casto, Bennett A. Joiner, Michael B. McShane, Method for making a thermally enhanced semiconductor device by holding a leadframe against a heatsink through vacuum suction in a molding operation ,(1991)
Kenneth Burton Gilleo, Jason Sweis, Method of forming interface between die and chip carrier ,(1994)