Wire bonding for interconnection between interposer and flip chip die
作者： Glenn Enrick Calderon Cosue , Timer Derequito Porras , Gerardo Calderon Angeles , Edgardo Rulloda Hortaleza
DOI:
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摘要: An integrated circuit (IC) device includes an interposer having a dielectric substrate first side, second and inner aperture, wherein plurality of electrically conductive traces are on the side. IC die topside semiconductor surface active circuitry bottomside surface, bond pads, is attached over aperture onto interposer. First wirebond interconnects couple respective pads to traces. A workpiece top including contact thereon side Second workpiece.
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