Circuit component built-in module with embedded semiconductor chip and method of manufacturing

摘要: A circuit component built-in module includes: a first electrical insulating substrate made of mixture containing an inorganic filler and thermosetting resin; plurality wiring patterns formed at least on principal surface the substrate; semiconductor chip incorporated in connected electrically with patterns; inner vias connecting one another, passing through substrate. In module, has thickness not less than 30 μm more 100 μm, non-wired ground, range 80 200 μm. With this configuration, high-performance compact-size which components are mounted high density is provided so as to be used suitably various types electronic information devices.