Semiconductor device and method for forming a low profile embedded wafer level ball grid array molded laser package (EWLP-MLP)
作者： Jianmin Fang , Pandi C. Marimuthu , Yaojian Lin , Jose A. Caparas , Kang Chen
DOI:
关键词:
摘要: A semiconductor device has a die with an encapsulant deposited over and around the die. An interconnect structure is formed first surface of encapsulant. opening from second to expose structure. bump recessed within disposed package provided. The electrically connected bump. plurality structures connect includes memory device. height less than 1 millimeter. tapered sidewall by laser direct ablation.
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