Stack-type semiconductor package, method of forming the same and electronic system including the same
作者： Sang-uk Han , Jung-Do Lee , Tae-hun Kim , Seon-Hyang You , Hak-kyoon Byun
DOI:
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摘要: A stack-type semiconductor package, a method of forming the same, and an electronic system including same are provided. The package includes: lower printed circuit board having plurality connection bumps disposed on upper surface interconnections; at least one first chip sequentially stacked electrically connected to molding resin compound covering chips; double-sided wiring bonded bumps; interconnection pattern board.
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