Epoxy resin containing an epoxy resin-modified silicone oil flexibilizer

摘要: An epoxy resin composition for encapsulating a semiconductor device comprises flexibilizer obtained by pre-reaction of an and at least one modified silicone oil having the formula: ##STR1## where R1, R3, R4 are divalent organic groups; R21, R22, R23, R24, R25, R26, R27 respectively selected from group consisting alkyl 1 to 5 carbon atoms, hydroxyalkyl alkoxy phenyl group, fluorine-substituted atoms; is integer 10 300; b 2 10, in which 0≦b/(a+b)≦0.32, wherein equivalent ratio phenolic hydroxyl groups said 0.001 0.4:1; other than flexibilizer; curing agent.