Apparatus for monitoring bonding surface bouncing, wire bonding apparatus having the same and method for monitoring bonding surface bouncing

作者: Soo Seong Kim

DOI:

关键词: Capillary actionDetectorSurface (mathematics)NanotechnologyWire bondingChemistryComposite material

摘要: There are provided an apparatus for monitoring bonding surface bouncing, a wire having the same, and method bouncing. According to aspect of present invention, bouncing includes sensor measuring capillary height in real time during detector extracting change rate from measured performing period detecting whether is by comparing extracted with set reference rate.