Methods of operating bonding machines for bonding semiconductor elements, and bonding machines
作者： Michael P. Schmidt-Lange , Matthew B. Wasserman , Thomas J. Colosimo
DOI:
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摘要: A method of operating a bonding machine for semiconductor elements is provided. The includes the steps of: (a) measuring time based z-axis height measurement characteristic bond head assembly during model process; (b) determining adjustment profile subsequent process on measured characteristic; and (c) adjusting position with motion system using profile.
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