Die Bonder and Bonding Method
作者： Masayuki Mochizuki , Hiroshi Maki , Yukio Tani , Takehito Mochizuki
DOI:
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摘要: A die bonder and a bonding method are provided that capable of surely mounting on an intermediate stage picking up the from thus, high in reliability. The is with for thereon picked by pickup head supply unit. portion uneven pattern including plurality support protrusions having contact surfaces flush back surface supporting not to slip out place, recesses formed between protrusions.
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