作者: Junichi Inoue , Tomonori Ogura , Kenji Kintaka , Kenzo Nishio , Yasuhiro Awatsuji
关键词: Dry etching 、 Optics 、 Fabrication 、 Trench 、 Waveguide (optics) 、 Guided wave testing 、 Cladding (fiber optics) 、 Materials science 、 Microfabrication 、 Single-mode optical fiber
摘要: A new integration technique of a 45-degree micromirror providing vertical coupling between free-space wave and guided in dielectric-glass waveguide for high-density intra-board optical interconnection was described. planar consisting 4-μm-thickness GeO :SiO guiding core layer 2-μm-thickness SiO cladding on an substrate used characterization the micromirror. trench with 8-μm depth width formed by using dry etching technique. photoresist filling exposed at angle 45 degrees water to give taper trench. Au evaporated high-reflection An excess loss due insertion estimated be about 2 dB comparing losses waveguides without