Microelectronic bonding with lead motion
作者： Zlata Kovac , John Grange , Thomas H. DiStefano
DOI:
关键词: Materials science 、 Microelectronics 、 Semiconductor chip 、 Electrical engineering 、 First contact 、 Geometry 、 Offset (computer science)
摘要: A method of connecting a semiconductor chip assembly (12) having at least first and second contacts (18) to connection component (20) including leads (30) by means tool (60) consisting the steps juxtaposing moving corresponding contacts. The is juxtaposed with so that are aligned in such manner lead offset from contact direction same direction. moved substantially downwardly towards which opposite direction, an open space (A1) formed between facilitate movement
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