Method of forming an inlay substrate having an antenna wire
作者： David Finn
DOI:
关键词:
摘要: Forming an inlay comprising antenna wire having two end portions and a site for transponder chip, comprises: mounting the to surface of substrate; leaving free-standing, as loops adjacent terminal areas on substrate chip. With chip installed substrate, free-standing are repositioned be substantially directly over terminals in preparation interconnection then bonded terminals. An embedding tool may embed or adhesively place self-bonding substrate. The have chips, function secure inlay. anti-skimming feature is included
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