Linear, direct-drive microelectronic bonding apparatus and method

摘要: A linear, direct-drive microelectronic bonding apparatus (10) provides a bondhead mounting plate (20), stationary magnetic circuit (21), moving coil (22), primary wire clamp housing (23), transducer mount (24), and high frequency ultrasonic (25) (above 100 kHz), capillary (26). Bondhead assembly (16) is configured to present collective axial path bore (27) along which (12) fed bond site (28) for forming interconnections at (28). In accordance with the invention, protected method of feeding (28), while (21) (22) provide actuation in substantially linear downward direction towards site. contradistinction, prior art strokes, rather than being are arc-like due perpendicular one another. (26) axially aligned. The vertical stroke allows be used "deep access" packages other hard-to-reach sizes, shapes designs packages. addition, has reduced mass comparison which, conjunction energy low amplitude oscillation weld greater precision positioning.