作者: M. R. Holzworth , N. G. Rudawski , P. G. Whiting , S. J. Pearton , K. S. Jones
DOI: 10.1063/1.4813535
关键词: Scanning transmission electron microscopy 、 Stack (abstract data type) 、 Scanning electron microscope 、 Transistor 、 Wide-bandgap semiconductor 、 Electron mobility 、 Transmission electron microscopy 、 Layer (electronics) 、 Materials science 、 Analytical chemistry 、 Optoelectronics
摘要: AlGaN/GaN high electron mobility transistors were electrically stressed using off-state reverse gate biases. In devices demonstrating the largest, most rapid decrease in normalized maximum drain current, defects found at gate/AlGaN epilayer interface and characterized high-angle annular dark-field scanning transmission microscopy. These appear to be a reaction between Ni layer of Ni/Au metal stack AlGaN epilayer. Additionally, simulations electric field lines from defective match defect morphology. results provide important insight toward understanding failure mechanisms improving reliability Ni-gate transistors.