Field-induced defect morphology in Ni-gate AlGaN/GaN high electron mobility transistors

作者: M. R. Holzworth , N. G. Rudawski , P. G. Whiting , S. J. Pearton , K. S. Jones

DOI: 10.1063/1.4813535

关键词: Scanning transmission electron microscopyStack (abstract data type)Scanning electron microscopeTransistorWide-bandgap semiconductorElectron mobilityTransmission electron microscopyLayer (electronics)Materials scienceAnalytical chemistryOptoelectronics

摘要: AlGaN/GaN high electron mobility transistors were electrically stressed using off-state reverse gate biases. In devices demonstrating the largest, most rapid decrease in normalized maximum drain current, defects found at gate/AlGaN epilayer interface and characterized high-angle annular dark-field scanning transmission microscopy. These appear to be a reaction between Ni layer of Ni/Au metal stack AlGaN epilayer. Additionally, simulations electric field lines from defective match defect morphology. results provide important insight toward understanding failure mechanisms improving reliability Ni-gate transistors.

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