Coated means for connecting a chip and a card
作者： Claudius Feger , Linda Carolyn Matthew , John Joseph Liutkus , Nelson Russell Tanner , Charles Haile Wilson
DOI:
关键词: Bending 、 Chip 、 Composite material 、 Chip carrier 、 Temperature cycling 、 Engineering 、 Reliability (semiconductor) 、 FLEX 、 Electrical engineering
摘要: A flex or TAB product suitable for chip carrier applications wherein the reliability problems caused by copper dendrite growth and lead bending during power thermal cycling are reduced application of special coatings to areas tape.
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