Flexible high density interconnect structure and flexibly interconnected system
作者： William P. Kornrumpf , Charles W. Eichelberger , Robert J. Wojnarowski
DOI:
关键词:
摘要: A flexible high density interconnect structure is provided by extending the beyond solid substrate containing chips interconnected thereby. During fabrication, portion of supported a temporary support to facilitate fabrication in accordance with existing techniques. Subsequently, that may be removed or remain place if it sufficiently impart desired degree flexibility structure. Methods are also disclosed.
google.de 参考文章(44)
Shalabh Kumar, Keith R. Johnson, Compact digital resolver/encoder assembly with flexible circuit board ,(1985)
Shalabh Kumar, Keith R. Johnson, Digital resolver/encoder assembly ,(1988)
Charles W. Eichelberger, Robert J. Wojnarowski, Excimer laser patterning of a novel resist ,(1988)
Tatsuro Kikuchi, Tsuneshi Nakamura, Hybrid integrated circuit component and printed circuit board mounting said component ,(1982)
Toshikazu Yoshimizu, Kenichi Kurihara, Yukio Kadowaki, Shoji Matsumoto, Shunpei Tamaki, Masahiro Shindo, Toshio Kawakami, IC chip mounting method ,(1990)
Masaharu Noyori, Hiroaki Fujimoto, Electronics circuit device and method of making the same ,(1978)
Katunobu Awane, Shigeo Nakabu, Yuji Matsuda, Hirokazu Yoshida, Takashi Nukii, Masaru Iwasaki, Thin assembly for wiring substrate ,(1981)
James E. Kohl, Herbert S. Cole, Method of processing siloxane-polyimides for electronic packaging applications ,(1989)
Daniel J. Shanefield, Wafer scale integration ,(1985)
Charles William Eichelberger, Robert John Wojnarowski, Multichip integrated circuit packaging configuration and method ,(1986)