Printed circuit board assembly having adhesive joint
作者： David Neuman
DOI:
关键词: Dielectric 、 Printed circuit board 、 Soldering 、 Conductor 、 Materials science 、 Electrical conductor 、 Plating 、 Electroplating 、 Adhesive 、 Composite material
摘要: A new process for electrically and mechanically joining arrays of conductors on flexible printed circuits other including collated flat, cables (FFCs). An array flat copper a dielectric sheet is electroplated with tin-lead solder. Surface insulation locally omitted or removed from conductor surfaces. second circuit cable overlapped in competent electrical communication the solder plating fused by inductively heating to join two arrays. adhesive placed between also thermally activated bond film together. This insulates connections seals them attack moisture chemical pollutants.
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