Method and apparatus for producing a wafer
作者： Shigeki Itou , Takashi Yokoyama , Go Matsuda , Takahiro Mishima , Kazuma Yamamoto
DOI:
关键词: Etching (microfabrication) 、 Work environment 、 Ingot 、 Materials science 、 Wafer 、 Metallurgy 、 Surface smoothness 、 Engineering drawing
摘要: A method and an apparatus for cutting a wafer from crystalline ingot, by directing stream or streams of etching gas at the ingot in vacuum. Waste can be greatly minimized work environment also kept clean. Further, excellent surface smoothness realized on cut wafers.
lens.org 参考文章(13)
Junzo Wakuda, Tadashi Tonegawa, Multi-wire saw device for slicing a semi-conductor ingot into wafers with a cassette for housing wafers sliced therefrom, and slicing method using the same ,(1995)
Satoru Muramatsu, Method for manufacturing completely circular semiconductor wafers ,(1997)
Mehdi Balooch, Mohammed Reza Kambiz Farnaam, Farid Askary, Large cross-sectional area molecular beam source for semiconductor processing ,(1987)
Keizo Suzuki, Susumu Hiraoka, Shigeru Nishimatsu, Anisotropic etching of polycrystalline silicon with a hot Cl2molecular beam Journal of Applied Physics. ,vol. 64, pp. 3697- 3705 ,(1988) , 10.1063/1.341413
Yasuhiko Abe, Method for slicing a semiconductor silicon single crystal ,(1991)
Kohsaku Yano, Tetsuya Ueda, Apparatus for dry etching ,(1990)
Donna K. Pratt, Jamie B. Terrell, Chemical cutting method and apparatus ,(1984)
Kazuto Yamauchi, Yuzo Mori, Strainless precision after-treatment process by radical reaction ,(1988)
Brian I. Ashkenazi, Wafering device and method of using same ,(1987)
Lloyd W Young, Chelborg Rudolph, Machine for cutting tapered ingots ,(1947)