Adhesion quantification methods for wafer bonding
作者： Örjan Vallin , Kerstin Jonsson , Ulf Lindberg
DOI: 10.1016/J.MSER.2005.07.002
关键词: Microsystem 、 Cantilever 、 Test method 、 Wafer bonding 、 Mechanical engineering 、 Brittleness 、 Wafer 、 Forensic engineering 、 Integrated circuit 、 Materials science 、 Solid mechanics
摘要: Integrated circuit technology and its later development, microsystem technology, make good use of wafer bonding. An increased interest in bond adhesion quantification can be anticipated when wafer bonding is optimized for complex microelectro-mechanical systems where the bonding process must take every other component into consideration when it comes to cost, temperature budget and process compatibility. Adhesion quantification methods for evaluation of bonded brittle material, especially direct wafer bonded, are …
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