作者: Marlene Knausz , Gernot Oreski , Markus Schmidt , Peter Guttmann , Karl Berger
DOI: 10.1016/J.POLYMERTESTING.2015.04.009
关键词: Forensic engineering 、 Spectrum analyzer 、 Thermal expansion 、 Ultimate tensile strength 、 Differential scanning calorimetry 、 Composite material 、 Anisotropy 、 Shrinkage 、 Materials science 、 Solar cell 、 Photovoltaic system
摘要: Abstract The object of this paper is to determine the thermal expansion behavior nine different encapsulants in order identify possible deficiencies production processes and allow for optimization process parameters. High dimensional stability encapsulant great importance photovoltaic (PV) module avoid problems during lamination and/or application. For purpose, samples were heated twice a thermo-mechanical analyzer (TMA) tensile mode, coefficient (CTE) over temperature was evaluated. To get additional information about transition temperatures encapsulants, differential scanning calorimetry (DSC) measurements made. TMA results most showed anisotropic which eliminated after first heating run. Three shrinkage with subsequent increased as well behavior. It could be shown that knowing solar cell highly relevant PV process, Thermo-Mechanical Analysis proved suitable method evaluate also quality control encapsulation films.