Tamper-respondent assemblies with bond protection
作者： William L. Brodsky , Thomas Weiss , James A. Busby , David C. Long , Michael J. Fisher
DOI:
关键词: Materials science 、 Electrical conductor 、 Composite material 、 Bond 、 Chemical attack 、 Conductor 、 Structural engineering 、 Adhesive 、 Trace (semiology)
摘要: Methods of fabricating tamper-respondent assemblies with bond protection are provided which include at least one sensor having unexposed circuit lines forming, in part, or more tamper-detect network(s), and the external region. The assembly further includes conductive trace an adhesive. trace(s) forms, is exposed, on sensor(s) within region(s). adhesive contacts region(s) sensor(s), adhesive, facilitates securing assembly. In enhanced embodiments, a chemically compromisable conductor susceptible to damage during chemical attack
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