Circuit boards and electronic packages with embedded tamper-respondent sensor

摘要: Electronic circuits, electronic packages, and methods of fabrication are provided. The circuit includes a multilayer board, tamper-respondent sensor embedded within the board. defines, at least in part, secure volume associated with In certain implementations, tamper- respondent multiple layers board including, for instance, one or more frames mat layers, frame(s) being disposed, above layer(s), which together define where extending into embodiments, divided multiple, separate zones, including electrically connected to monitor circuitry volume.