Electronic component mounting package and electronic apparatus using the same
作者： Masahiko Taniguchi
DOI:
关键词: Signal 、 Terminal (electronics) 、 Electronic component 、 Base (geometry) 、 Thermal expansion 、 Composite material 、 Thermal conductivity 、 Materials science 、 Structural engineering
摘要: An electronic component mounting package includes a first base including an upper surface and through-hole vertically formed; second having arranged to be overlapped with the in plan view; sealing material filling through-hole; signal terminal that is fixed pass through has end portion protrudes upwardly from of base. The plurality metal members member, member interposed between members. A thermal expansion coefficient larger than conductivity higher
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