Semiconductor device header and semiconductor device
作者： Takumi Ikeda , Yasuyuki Kimura , Kazuya Terashima , Masao Kainuma
DOI:
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摘要: A semiconductor device header is provided with a base including main body and heat sink. lead inserted through hole extending the body. The defined by first opening second that opens in upper surface of communication smaller than plan view. filled an encapsulant seals lead. covering material having relative permittivity encapsulant. sink located at position partially overlapped view separated from
lens.org 参考文章(9)
Masahiko Taniguchi, Electronic component mounting package and electronic apparatus using the same ,(2011)
Nobuyuki Yasui, Optical semiconductor device package and optical semiconductor device ,(2005)
Osamu Kagaya, Semiconductor element mounting board and optical transmission module ,(2007)
Isao Oshima, Shinichi Takagi, Stem for optical element and optical semiconductor device using the same ,(2006)
Yong-Chan Keh, Mun-Kue Park, High speed TO-can based optical module ,(2003)
Masaya Ishida, Takeshi Horiguchi, Daisuke Hanaoka, Cap member and semiconductor device employing same ,(2008)
Sadakatsu Yoshida, 雅彦 谷口, Masahiko Taniguchi, 定功 吉田, Package for mounting electronic component and electronic device using the same ,(2010)
Yamamoto Goji, SEMICONDUCTOR LASER AND MANUFACTURING METHOD THEREOF ,(2007)
Ando Hiroyuki, Furukawa Kazuhiko, NITRIDE SEMICONDUCTOR LIGHT-EMITTING DEVICE ,(2008)