Stress Relaxation in Sn-Based Films: Effects of Pb Alloying, Grain Size, and Microstructure
作者： Nitin Jadhav , Jacob Wasserman , Fei Pei , Eric Chason
DOI: 10.1007/S11664-011-1829-0
关键词: Whiskers 、 Composite material 、 Surface layer 、 Microstructure 、 Metallurgy 、 Materials science 、 Grain size 、 Whisker 、 Stress relaxation 、 Relaxation (physics) 、 Stress (mechanics)
摘要: … of the stress apart from the IMC formation, in the current study we have directly measured stress relaxation behavior in films deposited on Si substrates without any Cu layer present. To …
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