Size effects on the mechanical properties of thin polycrystalline metal films on substrates

摘要: An analysis of the effects thickness and grain size polycrystalline thin films on substrates is presented with objective linking film mismatch stress to underlying characteristic scales. The model predicated notion that relaxation strain in accommodated by introduction dislocation loops whose population, dimensions interaction energies are controlled microstructural dimensions. capable capturing combined these scales accounting for constrained structure, provides quantitative predictions evolution during thermal excursions. compared available experimental results face-centered cubic materials Si substrates. It shown correctly predicts observed influence Aspects hardening high densities also discussed.