Nanomechanical fracture-testing of thin films
作者： M.D. Kriese , D.A. Boismier , N.R. Moody , W.W. Gerberich
DOI: 10.1016/S0013-7944(98)00050-2
关键词: Thin film 、 Strain energy release rate 、 Bilayer 、 Indentation 、 Fracture mechanics 、 Composite material 、 Materials science 、 Nanomechanics 、 Diamond 、 Delamination
摘要: Abstract Nanochemical testing techniques were used to quantitatively assess the adhesion of thin film-substrate systems. These utilized micron-scale diamond tips with instrumentation continuously measuring sub-nanometer and sub-millinewton resolutions. Delamination was modeled as an interfacial crack propagation problem, utilizing linear elastic fracture mechanics characterized by critical strain energy release rate. A 9.1 μm thick phenol–formaldehyde polymer film on stainless steel tested indentation, scratching edge-loading fine lines. Also, sputtered copper tungsten–copper bilayer films SiO2, 150 1500 nm thick, indentation.
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