The effect of post-annealing on the electrical properties of (Pb, Sr)TiO3 thin films prepared by liquid source misted chemical deposition for ultra large-scale integration (ULSI) dynamic random access memory (DRAM) capacitor

作者: Hyun Jin Chung , Suk Jin Chung , Jin Hong Kim , Seong Ihl Woo

DOI: 10.1016/S0040-6090(01)01015-X

关键词: DielectricInductively coupled plasmaStrontium titanateMaterials scienceAnnealing (metallurgy)Dielectric lossOptoelectronicsElectrodeThin filmEquivalent oxide thickness

摘要: The beneficial effect of post-annealing on the properties lead–strontium–titanate (PST) thin films prepared by liquid source misted chemical deposition are reported. Their composition and depth profile were uniform. dielectric constant loss 100-nm-thick Pb0.32Sr0.68TiO3 film annealed at 650°C for 5 min in air further 630°C 30 after top electrode 560 (equivalent oxide thickness=0.70 nm) 0.0173, respectively. Especially, leakage current density was greatly influenced post-heat treatment O2 N2 ambient gas Pt deposited a PST film. 1.85×10−8 A/cm2 1 V obtained 130-nm-thick treated inductively coupled plasma (ICP).

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