Inter-component Transitions for Ultra-bandwidth Integrations
作者： Guennadi A. Kouzaev
DOI: 10.1007/978-3-642-30310-4_7
关键词: Ground 、 Planar 、 Insertion loss 、 Electric power transmission 、 Microstrip 、 Bandwidth (signal processing) 、 Transmission line 、 Electronic engineering 、 Return loss 、 Computer science
摘要: In this Chapter, the planar and multi-level transitions between different transmission lines are considered. Among them ones realized using viaholes, EM coupling or combinations of both means. The most attention is paid to millimeter-wave ultra-wide bandwidth solutions for silicon technology. An theory grounding via-holes packages Contemporary state modeling multilayer motherboards shorted by multiple through-via-holes reviewed as well. References -104. Figures -16. Pages -34.
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