作者: Masayoshi Esashi
DOI: 10.1109/ICSICT.2008.4735114
关键词: Silicon carbide 、 Feedthrough 、 Wafer 、 Electronic engineering 、 Gyroscope 、 Silicon 、 Probe card 、 Optoelectronics 、 Microelectromechanical systems 、 Materials science 、 Etching (microfabrication)
摘要: Silicon MEMS as electrostatically levitated rotational gyroscope and 2D optical scanner, wafer level packaged devices integrated capacitive pressure sensor swatch are described. which use non-silicon materials diamond, CNT (carbon nano tube), LTCC with electrical feedthrough, SiC (silicon carbide) LiNbO3 for multi-probe data storage, multi-column electron beam lithography system, probe card wafer-level burn-in test, mold glass press molding SAW wireless passive respectively also