Further Enhancement of Thermal Conductivity through Optimal Uses of h-BN Fillers in Polymer-Based Thermal Interface Material for Power Electronics

摘要: Due to the demand of miniaturization and increasing functionality in power electronics, thermal dissipation becomes a challenging problem for management reliability. To enable effective heat transfer across interconnect interfaces, interface materials (TIMs) are required. Electrically insulating TIMs primarily polymer-based composites which use conductive fillers enhance conductivity (TC). In this study, optimal hybrid filler constituents, achieved through mixing spherical platelet h-BN particles with different ratios, TIM was predicted using finite element (FE) simulations. The underpinning mechanisms variation TC were analyzed from temperature distribution patterns micro flux paths. Results showed that same total volume fraction h-BN, mixed certain ratio can further improve properties compared those or alone.