Thermal Conductivity of Polymer-Based Composites: Fundamentals and Applications

作者: Hongyu Chen , Valeriy V. Ginzburg , Jian Yang , Yunfeng Yang , Wei Liu

DOI: 10.1016/J.PROGPOLYMSCI.2016.03.001

关键词: PolymerFiller (packaging)Carbon nanotubeBoron nitrideThermosetting polymerAggregate (composite)Materials scienceComposite materialCeramicThermal conductivity

摘要: … properties of thermally conductive fillers (carbon nanotubes, metal particles, and ceramic particles such as boron nitride or aluminum oxide… thermal conductivity in HDPE/Al binary …

参考文章(323)
Raymond B. Seymour, Charles E. Carraher, Thermal Properties of Polymers Springer, Boston, MA. pp. 83- 93 ,(1984) , 10.1007/978-1-4684-4748-4_7
Kankanhalli N. Seetharamu, Perumal Nithiarasu, Roland W. Lewis, Fundamentals of the Finite Element Method for Heat and Fluid Flow ,(2004)
Jong-Woo Bae, The properties of AlN-filled epoxy molding compounds by the effects of filler size distribution Journal of Materials Science. ,vol. 35, pp. 5907- 5913 ,(2000) , 10.1023/A:1026741300020
P.L. KAPITZA, THE STUDY OF HEAT TRANSFER IN HELIUM II Helium 4#R##N#The Commonwealth and International Library: Selected Readings in Physics. pp. 114- 153 ,(1971) , 10.1016/B978-0-08-015816-7.50014-6
V.E. Peletsky, A. Cezairliyan, K.D. Maglic, Compendium of thermophysical property measurement methods: Vol. 1, survey of measurement techniques Plenum Press,New York, NY. ,(1984)
Kouichi Tanaka, Shuji Ogata, Ryo Kobayashi, Tomoyuki Tamura, Takahisa Kouno, A molecular dynamics study on thermal conductivity of thin epoxy polymer sandwiched between alumina fillers in heat-dissipation composite material International Journal of Heat and Mass Transfer. ,vol. 89, pp. 714- 723 ,(2015) , 10.1016/J.IJHEATMASSTRANSFER.2015.05.080
Y. Wang, H. F. Zhan, Y. Xiang, C. Yang, C. M. Wang, Y. Y. Zhang, Effect of covalent functionalization on thermal transport across graphene-polymer interfaces Journal of Physical Chemistry C. ,vol. 119, pp. 12731- 12738 ,(2015) , 10.1021/ACS.JPCC.5B02920
Katsuo Sugawara, Yoshitaka Takazawa, Masaki Akatsuka, Thermosetting resin compounds ,(2006)