作者: S. D. Williams , Donald M. Curry
DOI: 10.2514/3.27987
关键词: Heat flux 、 Thermocouple 、 Space Shuttle 、 Materials science 、 Thermodynamics 、 Thermal conductivity 、 Orbiter 、 Mechanics 、 Thermal 、 Transient (oscillation) 、 Space Shuttle thermal protection system
摘要: A numerical method by which data from a single embedded thermocouple can be used to predict the transient thermal environment for both high- and low-conductivity materials is described. The results of an investigation performed verify clearly demonstrate that accurate surface heating conditions obtained 1.016 cm in material. Space Shuttle Orbiter protection system having temperature- pressure-dependent properties typical entry were accuracy analytical procedure. Analytically generated, as well experimental, compare predicted measured temperatures.