作者: A. Valenzuela , J. C. Eckardt
DOI: 10.1063/1.1684840
关键词: Copper 、 Tin 、 Metal 、 Nickel 、 Evaporation (deposition) 、 Fabrication 、 Layer (electronics) 、 Composite material 、 Deposition (law) 、 Materials science 、 Instrumentation (computer programming)
摘要: Metal foils are prepared by the technique of evaporation and deposition on a plastic backing, which is subsequently dissolved in acetone. Destruction upon traversing air‐liquid interface avoided letting them traverse first layer ether does not dissolve plastic. During whole procedure fabrication never removed from frame originally mounted. Foils have been following metals: copper, gold, nickel, silver tin. Thicknesses as low 8 μg/cm2 (76 A Ag) obtained.