Thermally Enhanced Stacked Package and Method
作者： Weifeng Liu , Anwar A. Mohammed
DOI:
关键词: Substrate (printing) 、 Chip 、 Materials science 、 Heat spreader 、 Thermal conductivity 、 Electronic engineering 、 Composite material 、 Thermal contact
摘要: A package-on-package (POP) device (10) is provided. The includes a first package (16) with chip (22) mounted on substrate (24), heat spreader (18) stacked the (16), in thermal contact (22), and second (20) (18). In an embodiment, formed using carbon fibers to provide good lateral conductivity. ends (36) of project beyond periphery (38) packages (16,20).
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