Electronic package and method of assembling the same
作者： Damaruganath Pinjala , Nagarajan Ranganathan , Qingxin Zhang , Ebin Liao , Navas Khan Oratti Kalandar
DOI:
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摘要: An electronic package (200) comprises a substrate (201), first carrier layer arrangement (211) adapted to dissipate heat from at least one chip (217) mounted thereon, and exchanger (221) on the arrangement. The internal microchannel (213), which is fluidically interconnected with though an inlet (215) outlet (219). exchange further pump (223) controlling fluid flow through (213). may comprise stack of arrangements (211), each have or more chips thereon.
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