Chip packaging module with active cooling mechanisms
作者： Stephen Buchwalter , Lawrence Mok , Leena Buchwalter
DOI:
关键词:
摘要: The invention is directed to structure and methods of improving the cooling capacity chip packaging modules. module has a substrate with thin-film wiring on one side grooves or channels etched both sides where coolant pumps are embedded. used enhance liquid flowing inside module. flows through chips within vias in around when do not have vias. Both modes, single two-phase modes can be adopted
lens.org 参考文章(7)
Joseph F. Ahadian, Joanna M. London, Clifton G. Fonstad, Silicon on iii-v semiconductor bonding for monolithic optoelectronic integration ,(2000)
Yuji c, Masakatsu c, Motoyuki c, Koichi c, Masataka c, Masashi c, Heat pipe and process for manufacturing the same ,(1996)
George L. Fleischman, Bruce D. Marcus, Flat-plate heat pipe ,(1975)
Don W Noren, Method of forming a heat pipe ,(1970)
Hoon Song, Seog-Soon Baek, Byeoung Ju Ha, Yong-Soo Oh, Hyun-Cheol Kim, Method of fabricating micro electro mechanical system structure which can be vacuum-packaged at wafer level ,(2000)
Armin Klumpp, Christof Landesberger, Process for joining inorganic substrates in a permanent manner ,(1997)
Michal Edith Gross, Plated through hole interconnections ,(2001)