Cooling structure and heat generating body

作者: Shinichi Abe , Yasuhito Tanaka

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摘要: A cooling structure comprises: a first heat generating body (11); (3) which is joined to one surface of the body; second bodies (22, 23); and transfer plates (32, 33) body. The surface-to-surface at joining (3d) are (3c) body, not overlapping surface.

参考文章(25)
Bernd Bireckoven, Gerhard Koelle, Kuno Wolf, Dirk Scholz, Ralf Schmid, Alexander Wallrauch, Peter Urbach, Wolfgang Jacob, Hans-Reiner Krauss, Christoph Ruf, Juergen Zaremba, Power semiconductor module ,(2000)
Douglas Maly, Kanghua Chen, Gerardo Jimenez, Sayeed Ahmed, Pablo Rodriguez, Ajay Patwardhan, Power module with heat exchange ,(2003)
Stephen Buchwalter, Lawrence Mok, Leena Buchwalter, Chip packaging module with active cooling mechanisms ,(2003)
Hideo Ikeda, Motor driving inverter ,(2001)
Hermann Baumel, Hermann Kilian, Kurt Geiger, Gunter Leicht, Bernhard Schuch, Power module for the control of electric motors ,(1997)
Koichi Yahata, Yoshio Akaishi, Seigo Yukutake, Power converter unit ,(2007)
Michael J. Ellsworth, Madhusudan K. Iyengar, Robert E. Simons, Levi A. Campbell, Richard C. Chu, Liquid-cooled electronics rack with immersion-cooled electronic subsystems ,(2010)
Kuniaki Mamitsu, Yasuyoshi Hirai, Semiconductor device having radiation structure ,(2003)