Method for optimizing direct wafer bond line width for reduction of parasitic capacitance in MEMS accelerometers
作者： Daryl Sakaida , Howard Ge , Gabriel M. Kuhn , Henry C. Abbink
DOI:
关键词: Bond line 、 Optoelectronics 、 Wafer 、 Electronic engineering 、 Parasitic capacitance 、 Microelectromechanical systems 、 Water vapor 、 Materials science 、 Accelerometer
摘要: A method for optimizing direct wafer bond line width reduction of parasitic capacitance in a MEMS device by reducing the between first and second wafer, exposing to water vapor predetermined time period at temperature capable evaporating water, cooling freezing operating third determine if there is discontinuity during operation.
lens.org 参考文章(24)
Elmer S. Lacsamana, Manolo G. Mena, John R. Martin, Maurice S. Karpman, Lawrence E. Felton, William A. Webster, Michael P. Duffy, Method of producing a mems device ,(2005)
Gaetan L. Mathieu, Chadwick D. Sofield, Gary W. Grube, Benjamin N. Eldridge, Method to build robust mechanical structures on substrate surfaces ,(2010)
Mark Feldman, Tamarak Pandhumsoporn, Recessed bonding of target for RF diode sputtering ,(2000)
Timothy A. Estes, Robert Neves, Method and apparatus for rapid thermal testing ,(2004)
Jimmy R. Reed, Floyd M. Hosking, James L. Jellison, Bruce Short, Fred Yost, Terri Giversen, Solderability test system ,(1995)
Wolfgang Reinert, Dirk Kaehler, Peter Merz, Method for testing the leakage rate of vacuum capsulated devices ,(2005)
Christophe Legoux, René Presset, Capacitive microsensor with low parasitic capacitance and manufacturing process ,(1994)
Teruyo Noguchi, Hiroshi Sakata, Youichi Haruta, Hiroshi Yasuda, Printed circuit board and method for making the same ,(1977)
Leonard Forbes, Kie Y. Ahn, Silicon interposer with optical connections ,(2001)
Douglas A. Knapp, Larry Lee Jordan, Glass frit wafer bonding process and packages formed thereby ,(2001)