作者: Nam Hyo Moon , Park Cheol Min , Lee Buem Jae , Kim Hyo Young
DOI:
关键词: Solderability 、 Tin plating 、 Metallurgy 、 Copper alloy 、 Materials science
摘要: The present invention provides a method of tin-plating copper alloy for electric or electronic parts and automobile which has an excellent insertion force, heat-resistant peeling, solderability, material manufactured therefrom.